Multi x-layer board has a higher operating capacity and can run at higher speeds, which is often necessary for the advanced devies they power and allows for improved performance. Impedance management is important for stable sighal transmission and reception.
1. Capabilities :
* Edge plating for shielding and ground connection
* Cavities, countersunk holes or depth milling
* Thick copper upto 140um(inner and outer x-layers)
* Controlled impedance(Single, differential, etc)
* All recognized printed circuit board industry surfaces available.
2. Special capabilities :
* Back drill
* Various Low DK material available.
. Application : High radio frequency / Network / Military / Medical / Aerospace